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In-situ characterization of tool temperatures using in-tool integrated thermoresistive thin-film sensors

González, Germán 1; Plogmeyer, Marcel; Schoop, Julius; Bräuer, Günter; Schulze, Volker 1
1 Institut für Produktionstechnik (WBK), Karlsruher Institut für Technologie (KIT)


Metal cutting is characterized by high temperatures at the tool-workpiece interface. Although valuable information could be provided by the temperature values, their direct measurement still presents a challenge due to the high contact pressure and the inaccessibility of the process kinematic. In this research work, the current state of thin-film sensors for measuring temperatures on the chip-tool interface has been analyzed with a focus on the measuring phenomena: thermoelectricity and thermoresistivity. Thin-film sensors placed on the cutting tools in or close to the tool-chip contact area are expected to obtain accurate temperature information at the expense of a short lifetime. New insights into thin-film sensors manufacturing, design and calibration are presented, and a new concept of a three-point thermoresistive thin-film sensor is proposed. During orthogonal cutting tests the workpiece deformations were measured through high-speed imaging and the process temperatures were measured with thin-film sensors. In order to validate the temperatures and to obtain the temperature distribution on the cutting edge, Finite Element simulations were carried out. ... mehr

Verlagsausgabe §
DOI: 10.5445/IR/1000155564
Veröffentlicht am 02.02.2023
DOI: 10.1007/s11740-023-01186-7
Zitationen: 1
Zitationen: 2
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Produktionstechnik (WBK)
Publikationstyp Zeitschriftenaufsatz
Publikationsdatum 31.01.2023
Sprache Englisch
Identifikator ISSN: 0944-6524, 1863-7353
KITopen-ID: 1000155564
Erschienen in Production Engineering
Verlag Wissenschaftliche Gesellschaft für Produktionstechnik e.V. (WGP)
Schlagwörter Thin-film sensor, Orthogonal cutting, High-speed imaging, Temperature measurement
Nachgewiesen in Scopus
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