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Memory Carousel: LLVM-Based Bitwise Wear-Leveling for Non-Volatile Main Memory

Holscher, Nils; Hakert, Christian; Nassar, Hassan ORCID iD icon 1; Chen, Kuan-Hsun; Bauer, Lars 1; Chen, Jian-Jia; Henkel, Jorg 1
1 Institut für Technische Informatik (ITEC), Karlsruher Institut für Technologie (KIT)

Abstract:

Emerging non-volatile memory yields, alongside many advantages, technical shortcomings, such as reduced cell lifetime. Although many wear-leveling approaches exist to extend the lifetime of such memories, usually a trade-off for the granularity of wear-leveling has to be made. Due to iterative write schemes (repeatedly sense and write), wear-out of memory in certain systems is directly dependent on the written bit value and thus can be highly imbalanced, requiring dedicated bit-wise wear-leveling. Such a bit-wise wear-leveling so far has only be proposed together with a special hardware support. However, if no dedicated hardware solutions are available, especially for commercial off-the-shelf systems with non-volatile memories, a software solution can be crucial for the system lifetime. In this work, we propose entirely software-based bit-wise wearleveling, where the position of bits within CPU words in main memory is rotated on a regular basis. We leverage the LLVM intermediate representation to adjust load and store operations of the application with a custom compiler pass. Experimental evaluation shows that the lifetime by applying local rotation within the CPU word can be extended by a factor of up to 21×. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000156414
Veröffentlicht am 21.03.2023
Originalveröffentlichung
DOI: 10.1109/TCAD.2022.3228897
Scopus
Zitationen: 1
Web of Science
Zitationen: 1
Dimensions
Zitationen: 2
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Technische Informatik (ITEC)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2022
Sprache Englisch
Identifikator ISSN: 0278-0070, 1937-4151
KITopen-ID: 1000156414
Erschienen in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Band 42
Heft 8
Seiten 2527 - 2539
Vorab online veröffentlicht am 14.12.2022
Nachgewiesen in Scopus
Dimensions
Web of Science
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