KIT | KIT-Bibliothek | Impressum | Datenschutz

Sub-kHz-linewidth external-cavity laser (ECL) with Si$_3$N$_4$ resonator used as a tunable pump for a Kerr frequency comb

Maier, Pascal ORCID iD icon 1,2; Chen, Yung 1; Xu, Yilin 1,2; Bao, Yiyang ORCID iD icon 1,2; Blaicher, Matthias 1; Geskus, Dimitri; Dekker, Ronald; Liu, Junqiu; Dietrich, Philipp-Immanuel 1,2; Peng, Huanfa 1; Randel, Sebastian 1; Freude, Wolfgang 1; Kippenberg, Tobias J.; Koos, Christian 1,2
1 Institut für Photonik und Quantenelektronik (IPQ), Karlsruher Institut für Technologie (KIT)
2 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)

Abstract:

Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical linewidths. External feedback circuits can be efficiently implemented using low-loss silicon nitride (Si$_3$ N$_4$) waveguides, which do not suffer from two-photon absorption and can thus handle much higher power levels than conventional silicon photonics. However, co-integrating III-V-based gain elements with tunable external feedback circuits in chip-scale modules still represents a challenge, requiring either technologically demanding heterogeneous integration techniques or costly high-precision multi-chip assembly, often based on active alignment. In this work, we demonstrate Si$_3$N$_4$-based hybrid integrated ECL that exploit 3D-printed structures such as intra-cavity photonic wire bonds and facet-attached microlenses for low-loss optical coupling with relaxed alignment tolerances, thereby overcoming the need for active alignment while maintaining the full flexibility of multi-chip integration techniques. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000156919
Veröffentlicht am 17.03.2023
Originalveröffentlichung
DOI: 10.1109/JLT.2023.3243471
Scopus
Zitationen: 7
Dimensions
Zitationen: 9
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2023
Sprache Englisch
Identifikator ISSN: 0733-8724, 1558-2213
KITopen-ID: 1000156919
HGF-Programm 43.32.03 (POF IV, LK 01) Designed Optical Devices & Systems
Erschienen in Journal of Lightwave Technology
Verlag Optica Publishing Group (OSA)
Band 41
Heft 11
Seiten 3479-3490
Vorab online veröffentlicht am 09.02.2023
Schlagwörter Hybrid integrated circuit packaging, laser tuning, lenses, multichip modules, optical interconnections, optical solitons, optical waveguides, photonic integrated circuits, pump lasers, semiconductor lasers, semiconductor optical amplifiers, silicon nitride, three-dimensional printing
Nachgewiesen in Dimensions
Scopus
Web of Science
Relationen in KITopen
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft
KITopen Landing Page