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In memory of Glen Longhurst (1943-2022)

Vladimirov, Pavel V. ; Dorn, Christopher K.

Abstract (englisch):

This presentation is devoted to the memory of our colleague and dear friend, Prof. Dr. Glen Longhurst, who passed away on May 12, 2021. Together with Mario Dalle Donne, Hiroshi Kawamura and Vladimir Shestakov, Glen was one of the co-founders of the Beryllium Workshop in 1991. After that, he was a member of the International Organizing Committee (IOC) for many years, and he actively worked on further development of the Workshop Series. In 2005, Glen hosted the BeWS-7 in Santa Barbara, California, USA as a satellite meeting of the ICFRM-12 conference, and the workshop was a great success. In 2012 during the BeWS-10 in Karlsruhe, he suggested the establishment of the Mario Dalle Donne Memorial award to honor outstanding contributions by scientists working in beryllium area. In the field of beryllium technology, Glen was well known for his investigations of beryllium behavior under irradiation, its handling, recycling, application for fusion and, especially, for his studies on the retention of accumulated tritium within beryllium. Glen developed the Tritium Migration Analysis Program (TMAP) for simulation of tritium transport and release, which has survived through seven major releases and is still regarded as the gold standard in the field today. ... mehr


Verlagsausgabe §
DOI: 10.5445/KSP/1000156312
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien – Angewandte Werkstoffphysik (IAM-AWP)
Publikationstyp Proceedingsbeitrag
Publikationsjahr 2023
Sprache Englisch
Identifikator ISSN: 1869-9669
KITopen-ID: 1000160099
HGF-Programm 31.13.04 (POF IV, LK 01) In Vessel Components
Erschienen in Proceedings of the 15th International Workshop on Beryllium Technology (BeWS-15) September, 14-15, 2022, Karlsruhe, Germany
Veranstaltung 15th International Workshop on Beryllium Technology (BeWS 2022), Karlsruhe, Deutschland, 14.09.2022 – 15.09.2022
Verlag Karlsruher Institut für Technologie (KIT)
Serie KIT Scientific Reports ; 7764
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