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Pixel detector hybridisation with anisotropic conductive films

Schmidt, J. V. 1; Braach, J.; Dannheim, D.; De Oliveira, R.; Svihra, P.; Vicente Barreto Pinto, M.
1 Fakultät für Maschinenbau (MACH), Karlsruher Institut für Technologie (KIT)


Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such interconnect technologies need to be suitable for the assembly of single-dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative hybridisation concepts targeting vertex-detector applications at future colliders are under development. This contribution presents recent results of a newly developed in-house single-die interconnection process based on Anisotropic Conductive Film (ACF). The ACF interconnect technology replaces the solder bumps with conductive particles embedded in an adhesive film. The electro-mechanical connection between the sensor and the read-out chip is achieved via thermo-compression of the ACF using a flip-chip device bonder. A specific pad topology is required to enable the connection via conductive particles and create cavities into which excess epoxy can flow. This pixel-pad topology is achieved with an in-house Electroless Nickel Immersion Gold (ENIG) plating process that is also under development within the project. ... mehr

Verlagsausgabe §
DOI: 10.5445/IR/1000160911
Veröffentlicht am 25.07.2023
DOI: 10.1088/1748-0221/18/01/C01040
Zitationen: 1
Web of Science
Zitationen: 1
Zitationen: 2
Cover der Publikation
Zugehörige Institution(en) am KIT Fakultät für Maschinenbau (MACH)
Publikationstyp Zeitschriftenaufsatz
Publikationsdatum 01.01.2023
Sprache Englisch
Identifikator ISSN: 1748-0221
KITopen-ID: 1000160911
Erschienen in Journal of Instrumentation
Verlag Institute of Physics Publishing Ltd (IOP Publishing Ltd)
Band 18
Heft 01
Seiten Art.-Nr. C01040
Nachgewiesen in Dimensions
Web of Science
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