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Security Analysis of the Module Type Package Concept

Madsen, Marwin ORCID iD icon 1; Palmin, Anna; Stutz, Andreas; Barth, Mike ORCID iD icon 1
1 Institut für Regelungs- und Steuerungssysteme (IRS), Karlsruher Institut für Technologie (KIT)

Abstract:

To address the need for flexibility of production plants in the process industry modularization is a widely accepted approach. In particular, the Module Type Package Concept described in VDI/VDE/NAMUR 2658 is seen as a possible core part for modularization. A clear separation of engineering efforts into plant-independent module engineering and plant-specific integration engineering as well as a fast integration of a module's automation system into a higher-level process control system changes the fundamental automation architecture. However, in the state-of-the-art technical literature which has been analyzed and applied by the authors, few security considerations are made for modularization and especially the Module Type Package. This is even more problematic considering that even with an extensive field of security analysis, standards, and guidelines to secure conventional operational technology recent reports found severe vulnerabilities in those. This paper elaborates on security standards and guidelines to which the Module Type Package Concept should be compliant to achieve a high coverage regarding security requirements in the context of industrial automation and control systems. ... mehr


Originalveröffentlichung
DOI: 10.1109/INDIN51400.2023.10218151
Zugehörige Institution(en) am KIT Institut für Regelungs- und Steuerungssysteme (IRS)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 18.07.2023
Sprache Englisch
Identifikator ISBN: 978-1-66549-313-0
KITopen-ID: 1000162609
Erschienen in 2023 IEEE 21st International Conference on Industrial Informatics (INDIN), Lemgo, Germany, 17-20 July 2023
Veranstaltung 21st IEEE International Conference on Industrial Informatics (INDIN 2023), Lemgo, Deutschland, 17.07.2023 – 20.07.2023
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 1–8
Schlagwörter Module Type Package, IEC 62443, cyber security, IACS
Nachgewiesen in Scopus
Dimensions
Globale Ziele für nachhaltige Entwicklung Ziel 9 – Industrie, Innovation und Infrastruktur
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft
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