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A study on the effect of process parameters on feature resolution in 3D inkjet printing

Chen, Karin Jia-Yin ORCID iD icon 1; Elkaseer, Ahmed [Beteiligte*r] 1; Scholz, Steffen Gerhard [Beteiligte*r] ORCID iD icon 1
1 Institut für Automation und angewandte Informatik (IAI), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

Among the existing additive manufacturing (AM) technologies, 3D inkjet printing (3D-IJP), also known as material jetting, enables fabrication of intricate multi-materials parts with resolution and accuracy in the order of few microns. In 3D-IJP, a piezo-based printhead generates tiny droplets on a substrate which merge upon impact. The printing is followed by a curing step to solidify the wet printed layer before continuing with the next layer. The resulting print quality is governed by numerous process parameters. The aim of this investigation is to determine the influence of the process parameters UV-exposure time and print-velocity on the achievable feature resolution of the 3D printed part based on the USAF MIL-STD-150A resolution test chart. The trials were conducted on a 3D inkjet printer and a transparent UV-curable ink was used. This study showed that the USAF test coupon serves well to study the effect of printing parameters on feature resolution qualitatively. Several heights (0.5 mm to 2 mm) of the USAF test chart group 0 have been printed. Each group is made of three vertical and three horizontal lines. The printed lines were assessed based on a three-level grading system (partial merge = 2 of 3 adjacent lines merged, full merge = 3 of 3 lines merged, or no merging). ... mehr


Zugehörige Institution(en) am KIT Institut für Automation und angewandte Informatik (IAI)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 18.09.2023
Sprache Englisch
Identifikator KITopen-ID: 1000164714
HGF-Programm 43.31.02 (POF IV, LK 01) Devices and Applications
Erschienen in WCMNM 2023 Proceedings, World Congress on Micro and Nano Manufacturing, Evanston, 18th - 21st September 2023
Veranstaltung World Congress on Micro and Nano Manufacturing (WCMNM 2023), Evanston, IL, USA, 18.09.2023 – 21.09.2023
Bemerkung zur Veröffentlichung in press
Schlagwörter Proposal ID: 2021-027-030789; 3DP
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