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Systematic Investigation of Novel, Controlled Low‐Temperature Sintering Processes for Inkjet Printed Silver Nanoparticle Ink

Chen, Zehua ORCID iD icon 1; Gengenbach, Ulrich 1; Koker, Liane ORCID iD icon 1; Huang, Liyu 1; Mach, Tim P. ORCID iD icon 2; Reichert, Klaus-Martin 1; Thelen, Richard 3; Ungerer, Martin ORCID iD icon 1
1 Institut für Automation und angewandte Informatik (IAI), Karlsruher Institut für Technologie (KIT)
2 Institut für Angewandte Materialien – Energiespeichersysteme (IAM-ESS), Karlsruher Institut für Technologie (KIT)
3 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)

Abstract:

Functional inks enable manufacturing of flexible electronic devices by means of printing technology. Silver nanoparticle (Ag NP) ink is widely used for printing conductive components. A sintering process is required to obtain sufficient conductivity. Thermal sintering is the most commonly used method, but the heat must be carefully applied to avoid damaging low-temperature substrates such as polymer films. In this work, two alternative sintering methods, damp heat sintering and water sintering are systematically investigated for inkjet-printed Ag tracks on polymer substrates. Both methods allow sintering polyvinyl pyrrolidone (PVP) capped Ag NPs at 85°C. In this way, the resistance is significantly reduced to only 1.7 times that of the samples on polyimide sintered in an oven at 250°C. The microstructure of sintered Ag NPs is analyzed. Taking the states of the capping layer under different conditions into account, the explanation of the sintering mechanism of Ag NPs at low temperatures is presented. Overall, both damp heat sintering and water sintering are viable options for achieving high conductivity of printed Ag tracks. They can broaden the range of substrates available for flexible electronic device fabrication while mitigating substrate damage risks. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000165943
Veröffentlicht am 22.12.2023
Originalveröffentlichung
DOI: 10.1002/smll.202306865
Scopus
Zitationen: 3
Web of Science
Zitationen: 2
Dimensions
Zitationen: 4
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien – Energiespeichersysteme (IAM-ESS)
Institut für Automation und angewandte Informatik (IAI)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2024
Sprache Englisch
Identifikator ISSN: 1613-6810, 1613-6829
KITopen-ID: 1000165943
HGF-Programm 43.31.02 (POF IV, LK 01) Devices and Applications
Erschienen in Small
Verlag John Wiley and Sons
Band 20
Heft 21
Seiten Art.-Nr.: 2306865
Vorab online veröffentlicht am 21.12.2023
Schlagwörter 2022-028-031285 AFM
Nachgewiesen in Web of Science
Dimensions
Scopus
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