KIT | KIT-Bibliothek | Impressum | Datenschutz

Customized production of highly integrated 3D power electronic modules by multi-material vat photopolymerization, powder bed fusion and selective piezojet metallization [MultiPower]

Schubert, Johannes 1; Lehmann, Chantal-Liv 1; Zanger, Frederik ORCID iD icon 1; Schulze, Volker 1; Utsch, Daniel; Thielen, Nils; Franke, Jörg
1 Institut für Produktionstechnik (WBK), Karlsruher Institut für Technologie (KIT)

Abstract:

"In the AiF project MultiPower, the wbk Institute of Production Science at Karlsruhe Institute of Technology (KIT) and the Institute for Factory Automation and Production Systems (FAPS) at Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU) are investigating the customized production of highly integrated metal-ceramic composites for power electronic modules. The aim is to additively manufacture three-dimensional metal-ceramic composite bodies as circuit carriers to enable a good heat dissipation of the components by three-dimensional cooling structures. This can shorten the process chain and increase its flexibility.
Within the project, three approaches for manufacturing the composite bodies are investigated: 1) Manufacturing of ceramic substrates by vat photopolymerization (VPP-LED) and subsequent metallization by powder bed fusion (PBF-LB), 2) Manufacturing of ceramic substrates by vat photopolymerization (VPP-LED) and subsequent metallization by piezojet process, 3) Manufacturing of metal-ceramic composite components by the novel multi-material VPP process."


Zugehörige Institution(en) am KIT Institut für Produktionstechnik (WBK)
Publikationstyp Poster
Publikationsmonat/-jahr 06.2023
Sprache Englisch
Identifikator KITopen-ID: 1000169272
Veranstaltung 15th Internationaler MID-Kongress - Mechatronic Integrated Discourse (2023), Amberg, Deutschland, 21.06.2023 – 22.06.2023
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft
KITopen Landing Page