KIT | KIT-Bibliothek | Impressum | Datenschutz

Thermal Conductivity Analysis of Polymer‐Derived Nanocomposite via Image‐Based Structure Reconstruction, Computational Homogenization, and Machine Learning

Fathidoost, Mozhdeh ; Yang, Yangyiwei ; Thor, Nathalie ORCID iD icon; Bernauer, Jan; Pundt, Astrid 1; Riedel, Ralf; Xu, Bai-Xiang
1 Institut für Angewandte Materialien – Werkstoffkunde (IAM-WK), Karlsruher Institut für Technologie (KIT)

Abstract:

Macroscopic thermal properties of engineered or inherent composites depend substantially on the composite structure and the interface characteristics. While it is acknowledged that unveiling such dependency relation is essential for materials design, the complexity involved in, e.g., microstructure representation and limited data impedes the research progress. Herein, this issue is tackled by machine learning techniques on image-based microstructure and property data predicted from physics simulations, along with experimental validation. The
methodology is demonstrated for the model system ðHf$_{0,7}$ Ta$_{0,3}$ÞC= SiC ultrahightemperature ceramic nanocomposite. The structure is reconstructed from scanning electron microscope images, and is resolved by a diffuse-interface representation, which is advantageous in handling complicated structure and interface properties. Subsequently, hierarchical finite element homogenization is carried out to evaluate the effective thermal conductivity. A thorough comparison between the computed results and experimentally measured data, conducted
across diverse temperatures and varying interface thermal resistances, reveals a high level of agreement. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000169507
Veröffentlicht am 25.03.2024
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien – Werkstoffkunde (IAM-WK)
Publikationstyp Zeitschriftenaufsatz
Publikationsdatum 10.03.2024
Sprache Englisch
Identifikator ISSN: 1438-1656, 1527-2648
KITopen-ID: 1000169507
Erschienen in Advanced Engineering Materials
Verlag Deutsche Gesellschaft für Materialkunde e.V. (DGM)
Vorab online veröffentlicht am 01.03.2024
Nachgewiesen in Web of Science
Scopus
Dimensions
KIT – Die Forschungsuniversität in der Helmholtz-Gemeinschaft
KITopen Landing Page