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Thin Film Formation Based on a Nanoporous Metal–Organic Framework by Layer-By-Layer Deposition

Fratschko, Mario; Zhao, Tonghan ORCID iD icon 1; Fischer, Jan C. 1; Werzer, Oliver; Gasser, Fabian; Howard, Ian A. 1; Resel, Roland
1 Institut für Mikrostrukturtechnik (IMT), Karlsruher Institut für Technologie (KIT)

Abstract:

Understanding the structure of thin films is essential for successful applications of metal–organic frameworks (MOFs), such as low k-dielectrics in electronic devices. This study focuses on the thin film formation of the 3D nanoporous MOF Cu2(bdc)2(dabco). The thin films are prepared by a layer-by-layer technique with varying deposition cycles (1 to 50). Thin film morphologies and crystallographic properties were investigated using atomic force microscopy (AFM), Fourier transform infrared (FTIR) spectroscopy, and grazing-incidence X-ray diffraction (GIXD). AFM revealed an island growth (Volmer–Weber) with plate-like shaped islands. FTIR and GIXD revealed that Cu2(bdc)2(dabco) crystals form already during the first preparation cycle. The heights of the islands do not increase linearly with the number of deposition cycles, suggesting multiple growth stages. X-ray diffraction pole figures uncover a uniplanar texture of the Cu2(bdc)2(dabco) crystals, together with randomly oriented crystallites. The fraction of uniplanar oriented crystals increases with each deposition cycle, reaching a maximum of 75% at ten deposition cycles, simultaneously achieving complete substrate coverage. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000176983
Veröffentlicht am 05.12.2024
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Publikationstyp Zeitschriftenaufsatz
Publikationsdatum 22.11.2024
Sprache Englisch
Identifikator ISSN: 2574-0970
KITopen-ID: 1000176983
HGF-Programm 38.01.02 (POF IV, LK 01) Materials and Interfaces
Erschienen in ACS Applied Nano Materials
Verlag American Chemical Society (ACS)
Band 7
Heft 22
Seiten 25645–25654
Vorab online veröffentlicht am 01.11.2024
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