Dot‐by‐Dot Printing of Capacitors by Lift

Capacitors play a crucial role in modern electronics as they are widely employed for energy storage, signal processing,
radiofrequency tuning and matching, and signal filtering. This paper presents a novel approach to chip‐scale capacitor fabri-
cation utilizing the laser‐induced forward transfer (LIFT) technique, a versatile 3D printing method that offers a flexible and
cost‐effective alternative to conventional manufacturing processes. Plate capacitors were fabricated through dot‐by‐dot printing
of titanium di‐oxide and silver paste layers, and their performance evaluated. Optimal dot circularity at a diameter of 130 μm
were achieved with printing parameters of 120 mW for 4 ms, with no noticeable surface defects. Using smaller dots enabled
higher resolution, but this compromised the quality of the printed surface. The fabricated capacitors demonstrated a mean
capacity of 40.1 ± 2.2 pF at 100 MHz, making them suitable also for high‐frequency applications. The resistivity of the printed
silver tracks was 1.2 × 10 Ωm−7 , measured over 16 structures, and closely matched the manufacturer's specifications for the
silver ink. ... mehrThe achieved resolution from the dot‐by‐dot method used in this paper provided greater flexibility in transfer in
comparison to previously reported results using a square‐shaped transfer geometry.