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Flexible Ultra-Low Power Strain Gauge Readout Platform for Sensor-Integrating Bolts

Riehl, David; Herbst, Felix; Peters, Julian ORCID iD icon 1; Leiacker, Dirk; Matthiesen, Sven 1; Kupnik, Mario; Hofmann, Klaus
1 Institut für Produktentwicklung (IPEK), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

The monitoring of machine conditions and structural elements is crucial for predicting physical damage, avoiding downtime, and ensuring the reliability of critical infrastructure. sensor-integrating machine elements (SiMes) enable in-situ measurement of relevant parameters while maintaining compatibility with standard designs. However, the integration of sensors and electronic systems in these components is challenging due to strict spatial and structural constraints. This paper presents a compact, ultra-low power readout platform for sensor-integrating bolts, capable of multiaxial force and torque measurement. The platform utilizes a modular design, combining a flexible folded PCB for the measurement circuitry with rigid module for power supply and communication, optimizing the use of limited space. The modular approach allows evaluating application specific energy supply and communication protocols. The proposed strain gauge readout system minimizes the energy consumption per measurement and can compensate temperature dependent offset drift, making it a suitable solution for energy constrained applications in varying environmental conditions.


Originalveröffentlichung
DOI: 10.1109/I2MTC62753.2025.11078981
Scopus
Zitationen: 2
Dimensions
Zitationen: 2
Zugehörige Institution(en) am KIT Institut für Produktentwicklung (IPEK)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 19.05.2025
Sprache Englisch
Identifikator ISBN: 979-83-315-0500-4
KITopen-ID: 1000183496
Erschienen in 2025 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)
Veranstaltung IEEE International Instrumentation and Measurement Technology Conference (I²MTC 2025), Chemnitz, Deutschland, 19.05.2025 – 22.05.2025
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 1–6
Schlagwörter Sensor-integrating machine elements; strain gauge readout; flexible PCB; multiaxial force measurement; modular platform; ultra-low-power electronics; offset compensation; embedded systems; condition monitoring
Nachgewiesen in OpenAlex
Scopus
Dimensions
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