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Invited Paper: Hardware-Software Co-Design for Highly Optimized, Customized, and Reliable AI Systems

Henkel, Jörg 1; Tahoori, Mehdi 1; Khdr, Heba ORCID iD icon 1; Nassar, Hassan ORCID iD icon 1; Meyers, Vincent 1; Chen, Deming; Yildirim, Selin; Huang, Yingbing; Saxena, Nirmal R.; Hukerikar, Saurabh; Dhruvanarayan, Srivi
1 Institut für Technische Informatik (ITEC), Karlsruher Institut für Technologie (KIT)

Abstract:

Over the past decade, AI has been rapidly integrated into our daily life, coming in every shape and size and working across systems from big clouds to IoT. As a result, AI systems are increasingly requiring enhancements in model efficiency, hardware acceleration, and memory systems to satisfy stringent constraints on efficiency, reliability, and security. However, advancing across these fronts is challenging as compute demand outpaces Moore’s-law efficiency, hardening into an AI compute wall and an AI energy wall. Breaking through requires a unified AI co-design loop that co-optimizes algorithms and hardware, including efficient AI-to-hardware mapping, so that ongoing goals (accuracy, sparsity, latency) align with concrete hardware choices (precision modes, interconnects, memory hierarchies) and AI-specific execution and memory-reuse patterns. This paper details the principal co-design challenges, presents complementary strategies, and outlines a practical roadmap toward highly optimized, efficient, reliable, and secure AI systems.


Originalveröffentlichung
DOI: 10.1109/ICCAD66269.2025.11240678
Zugehörige Institution(en) am KIT Institut für Technische Informatik (ITEC)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 26.10.2025
Sprache Englisch
Identifikator ISBN: 979-8-3315-1560-7
KITopen-ID: 1000189947
Erschienen in 2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD)
Veranstaltung 44th IEEE/ACM International Conference On Computer Aided Design (ICCAD 2025), München, Deutschland, 26.10.2025 – 30.10.2025
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 9 S.
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