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Applying AI for and on Hardware: Cross-Layer Approaches for Security and Efficiency

Nassar, Hassan ORCID iD icon 1; Sikal, Mohammed Bakr ORCID iD icon 1; Biebert, Daniel; Hakert, Christian; Khdr, Heba ORCID iD icon 1; Lang, Michel; Schmid, Lena; Pauly, Markus; Gonzalez, Jeferson; Chen, Kuan-Hsun; Chen, Jian-Jia; Henkel, Jörg 1
1 Institut für Technische Informatik (ITEC), Karlsruher Institut für Technologie (KIT)

Abstract:

With the emergence of several powerful new models, AI became crucial in hardware design. It enhances performance, efficiency, and security. This paper examines AI in hardware security and optimization. We introduce AI methods for securing hardware: pre-deployment, at runtime, and post-deployment. Additionally, we present AI-driven strategies for system-level resource management on emerging manycore platforms with 3D-stacked memory, deploying neural networks to predict performance and thermal dynamics under migration and DVFS policies. On the other hand, we also improve the execution of ML models on hardware. First, we propose a training-time regularization technique for decision trees and random forests that enforces asymmetric splits, improving cache behavior with minimal accuracy loss. Second, we evaluate multiple model compression techniques for storing decision trees in memory-efficient formats, showing that specific schemes can simultaneously reduce memory and improve inference latency. Our methods, tested on real hardware or validated datasets, highlight trade-offs in model
complexity, hardware constraints, and system-level performance. ... mehr


Originalveröffentlichung
DOI: 10.1109/ICM66518.2025.11322515
Zugehörige Institution(en) am KIT Institut für Technische Informatik (ITEC)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 14.12.2025
Sprache Englisch
Identifikator ISBN: 979-8-3315-9370-4
KITopen-ID: 1000189951
Erschienen in 37th International Conference on Microelectronics (ICM 2025)
Veranstaltung 37th International Conference on Microelectronics (ICM 2025), Kairo, Ägypten, 14.12.2025 – 17.12.2025
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 10 S.
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