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Evaluating Decoupled Certificate Management in Modular Automation Architectures through Blockchain-Based Approaches

Madsen, Marwin ORCID iD icon 1; Schill, Tobias; Barth, Mike ORCID iD icon 1
1 Institut für Regelungs- und Steuerungssysteme (IRS), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

Modular automation architectures enable flexible, plug-and-play production systems by encapsulating individual control logic within independent modules. However, security mechanisms, and certificate management in particular, conflict with this paradigm because the current centralized design of public-key infrastructures makes it difficult to integrate heterogeneous communication protocols in nested architectures.

This work investigates blockchain-based certificate management as a decentralized alternative for enabling secure and automated trust infrastructures within process modules. Following a structured review of transferable blockchain PKI approaches from the IT domain, a synthesized architecture for operational technology environments is derived, and a proof-of-concept using Hyperledger Fabric with on-chain governance and off-chain threshold-signature operations is implemented. Validation in an industrial automation like environment demonstrates the feasibility of the approach while highlighting key limitations, particularly storage inefficiencies. The results indicate that purely IT-based proposals for blockchain-based certificate management are insufficient, but the proposed reference architecture provides a basis for adoption in industrial automation.


Zugehörige Institution(en) am KIT Institut für Regelungs- und Steuerungssysteme (IRS)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 08.09.2026
Sprache Englisch
Identifikator KITopen-ID: 1000194200
Erschienen in 31st IEEE International Conference on Emerging Technologies and Factory Automation (ETFA 2026)
Veranstaltung 31st IEEE International Conference on Emerging Technologies and Factory Automation (ETFA 2026), Västerås, Schweden, 08.09.2026 – 11.09.2026
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Bemerkung zur Veröffentlichung in Press
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