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A 140 GHz Aperture-Coupled Stacked Patch Antenna in Multilayer PCB Technology

Valenziano, Luca ORCID iD icon 1; Zwick, Thomas 1; Bhutani, Akanksha ORCID iD icon 1
1 Institut für Hochfrequenztechnik und Elektronik (IHE), Karlsruher Institut für Technologie (KIT)

Abstract:

This paper presents an 140 GHz aperture-coupled stacked patch antenna based on a multilayer printed circuit board process, mainly designed for upcoming 6G Device-to-Device (D2D) communication applications. The measurement results of three samples are discussed and evaluated with the corresponding simulations. The antenna achieves a return loss better 10 dB from 126.5 GHz up to 147.2 GHz, resulting in a bandwidth of 20.7 GHz, corresponding to a relative bandwidth of 15.13%. A maximum gain of 7.0 dBi was measured at 136.4 GHz. The influence due to the measurement setup and fabrication tolerances is discussed. This work demonstrates a convenient solution for a scalable high-frequency antenna design with mass production capability. As a result, this concept provides a solution for upcoming D2D communication systems at frequencies around 140 GHz.


Originalveröffentlichung
DOI: 10.1109/GeMiC71240.2026.11516437
Zugehörige Institution(en) am KIT Institut für Hochfrequenztechnik und Elektronik (IHE)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 09.03.2026
Sprache Englisch
Identifikator ISBN: 979-8-3195-1955-9
KITopen-ID: 1000194431
Erschienen in 2026 17th German Microwave Conference (GeMiC)
Veranstaltung 17th German Microwave Conference (GeMiC 2026), Karlsruhe, Deutschland, 09.03.2026 – 11.03.2026
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 49 - 52
Externe Relationen Siehe auch
Schlagwörter Aperture coupled patch antenna, device-to-device (D2D) communication, printed circuit board (PCB) antenna
Nachgewiesen in Scopus
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