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When Faults Don’t Vanish: Persistent Fault Injection and Key Recovery on MRAM-Backed AES

Sapui, Brojogopal 1; Pal, Priyanjana ORCID iD icon 1; Tahoori, Mehdi B. 1
1 Institut für Technische Informatik (ITEC), Karlsruher Institut für Technologie (KIT)

Abstract:

Spin-Transfer Torque MRAM (STT-MRAM) is gaining popularity as a leading non-volatile memory (NVM) for embedded, IoT, and automotive systems, owing to its low leakage, high endurance, and compatibility with CMOS processes. However, its magnetic nature and non-volatility feature introduce unique fault behaviors that differ fundamentally from conventional volatile memories such as SRAM and DRAM. In particular, faults injected during MRAM write operations may persist across power cycles, enabling attackers to exploit stable key corruptions. In this work, we present a persistent fault analysis (PFA) framework targeting AES implementations where the round-key schedule is stored in STT-MRAM. We demonstrate how carefully timed voltage glitches during MRAM write cycles can create reproducible, persistent bit flips that propagate through the AES key schedule. These persistent corruptions significantly reduce the ciphertext requirements for differential fault analysis (DFA) and enable statistical persistent fault analysis (SPFA) with only 12–17 faulty ciphertexts. These findings highlight that MRAM-based systems are exposed to a persistent-fault threat model different from transient faults in volatile memories, with direct implications for secure key storage and cryptographic implementations.


Originalveröffentlichung
DOI: 10.23919/DATE69613.2026.11539198
Zugehörige Institution(en) am KIT Institut für Technische Informatik (ITEC)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 20.04.2026
Sprache Englisch
Identifikator ISBN: 978-3-9826741-1-7
ISSN: 1530-1591
KITopen-ID: 1000194763
Erschienen in 2026 Design, Automation & Test in Europe Conference (DATE)
Veranstaltung 29th Design, Automation and Test in Europe Conference (DATE 2026), Verona, Italien, 20.04.2026 – 22.04.2026
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 1–7
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