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The Capillary Suspension Concept Is Used to Obtain Polymer-Free Particle Contacts Enhancing Conductivity of Highly Filled Polymer Composites

Dyhr, Katrin 1; Abdel Aal, Karim 1; Steck, Anna-Maria 1; Willenbacher, Norbert 1
1 Institut für Mechanische Verfahrenstechnik und Mechanik (MVM), Karlsruher Institut für Technologie (KIT)

Abstract:

Usually, particle morphology and surface treatment are adjusted to achieve high conductivity in highly filled conductive polymer composites. Here, we demonstrate that this key property can be further improved by keeping the particle contact regions free of polymer using an extension of the capillary suspension concept. If the secondary liquid is chosen such that it remains in the contact areas between conductive particles during solidification of the polymer phase, then the composite conductivity substantially increases. For both a thermoset and a thermoplastic model system including 40 vol.% silver particles in the paste, the conductivity was more than doubled compared to the respective binary system, reaching conductivity values up to (4.3 ± 0.2) × 106 Sm−1. SEM images clearly show the polymer-free contact regions in samples with enhanced conductivity. However, conductivity only increases if the secondary fluid is removed after solidification of the polymer phase. Thus, the capillary suspension concept can be used for a controlled modification of particle–particle contacts and represents a generic, viable strategy for enhancing conductivity in highly filled polymer composites. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000194784
Veröffentlicht am 29.06.2026
Originalveröffentlichung
DOI: 10.3390/jcs10070338
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Mechanische Verfahrenstechnik und Mechanik (MVM)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2026
Sprache Englisch
Identifikator ISSN: 2504-477X
KITopen-ID: 1000194784
Erschienen in Journal of Composites Science
Verlag MDPI
Band 10
Heft 7
Seiten 338
Vorab online veröffentlicht am 26.06.2026
Schlagwörter low temperature curing; printed electronics; conductivity enhancement; polymeric binders; solar cell metallization
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