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Uplifting 2D to 3D Human Poses with Joint Rotations and Bone Constraints: A Strong Baseline for Sports and Fitness Applications

Cormier, Mickael ORCID iD icon 1; Zolk, Jeremy; Laubenheimer, Astrid; Beyerer, Jürgen 1
1 Institut für Anthropomatik und Robotik (IAR), Karlsruher Institut für Technologie (KIT)

Abstract:

Accurate 3D human pose estimation plays a pivotal role in AI-driven systems for assessing and improving skilled human activities in domains such as fitness and sports. Despite significant progress in 2D-to-3D pose uplifting, current methods often focus on isolated components, such as kinematics modeling, bone-length constraints, or joint orientation estimation. Surprisingly, little effort has been made to combine these complementary approaches into a unified framework, even though their integration could naturally enhance performance. To address this, we introduce a strong baseline for 2D-to-3D pose uplifting that combines quaternion-based joint orientation estimation, bone length constraints for anatomically plausible predictions, and kinematic modeling for improved stability. Our approach is evaluated on the traditional Human3.6M dataset, and three challenging, underexplored benchmarks: Fit3D, which focuses on fitness exercises, AthletePose3D, designed to study professional athletic performance, and Harmony4D with complex inter-person interactions. These datasets pose unique challenges, such as high-speed and non-regular motions, which are more representative of real-world applications than conventional datasets. ... mehr


Originalveröffentlichung
DOI: 10.1109/FG67764.2026.11556513
Zugehörige Institution(en) am KIT Institut für Anthropomatik und Robotik (IAR)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 25.05.2026
Sprache Englisch
Identifikator ISBN: 979-8-3315-7231-0
KITopen-ID: 1000195147
Erschienen in 2026 IEEE 20th International Conference on Automatic Face and Gesture Recognition (FG)
Veranstaltung 20th IEEE International Conference on Automatic Face and Gesture Recognition (FG 2026), Kyōto, Japan, 25.05.2026 – 29.05.2026
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 1–9
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