Evaluation and improvement of the thermal performance of power modules using the Finite-Element-Method (FEM) and Multi-Material Additive Manufacturing (MMAM)

Mechatronic Integrated Devices (MID) for high temperature and harsh environments include power electronic applications. There is a growing need for innovative packaging concepts that enhance thermal performance, and reliability while offering greater manufacturing efficiency. This work proposes a novel approach that combines the evaluation of thermal and thermo-mechanical performance of various innovative designs using numerical simulations with the design freedom of the additive manufacturing technology Vat Photopolymerization (VPP), including an advanced multi-material process with ceramic and metallic slurries. It can be found that the thermal performance is reduced by 16% using aluminum nitride as ceramic material and innovative comprised module designs, which can be demonstrated by thermal simulations and printed by VPP in one single machine.