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The thermal impedance integral and the pathway decomposition of supercritical turbulent heat transfer. Part II. Experimental validation and scope of the linearised pathway form

Otic, Ivan ORCID iD icon 1; Ertunç, Özgür
1 Institut für Thermische Energietechnik und Sicherheit (ITES), Karlsruher Institut für Technologie (KIT)

Abstract:

In Part~I the generalised Lyon integral was shown to become a thermal impedance when the pseudocritical barrier sweeps the boundary layer, and a two-point quadrature at the barrier
yielded the linearised pathway form LinP, $\mathrm{Nu}_b = \sqrt{\mathrm{Re}_b}\,\mathrm{Pr}_b^{-1/2} (\mathrm{Pr}_b/\mathrm{Pr}_w)^{1/4}$, with the symmetric weight $w = 1/2$ and $\beta = 1/2$ fixed from classical correlation families. LinP is tested here in two stages against an experimental database spanning supercritical water at $23.5$--$24.5$\,MPa and CO$_2$ at
$9$\,MPa, Reynolds numbers $2.5 \times 10^4$ to $2 \times 10^6$, Prandtl numbers $0.8$ to $14$, and upward, downward and horizontal pipes. The first stage operates directly on the
measured impedance. Across $2201$ measurement stations the wall-to-bulk impedance bias falls from $76\,\%$ for Dittus--Boelter to $6\,\%$ for the pathway form, and the effective pathway weight crosses $1/2$ at the bulk pseudocritical crossing for both fluids and all Reynolds numbers, a parameter-free confirmation of the symmetric weight. The second stage tests LinP predictively in the engineering-relevant Q-mode against the bulk-anchored entangled Bishop and the wall-anchored entangled Swenson correlations and the uncorrected Dittus--Boelter.
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Volltext §
DOI: 10.5445/IR/1000196041
Veröffentlicht am 13.08.2026
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Thermische Energietechnik und Sicherheit (ITES)
Publikationstyp Forschungsbericht/Preprint
Publikationsmonat/-jahr 08.2026
Sprache Englisch
Identifikator KITopen-ID: 1000196041
HGF-Programm 32.12.01 (POF IV, LK 01) Design Basis Accidents and Materials Research
Verlag Karlsruher Institut für Technologie (KIT)
Umfang 36 S.
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