Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers Ishikawa, D.; An, B. N.; Mail, M.; Wurst, H.; Leyrer, B.; Blank, T.; Weber, M.; Ueda, S.; Nakako, H.; Kawana, Y. 2019. 2019 International Conference on Electronics Packaging, ICEP 2019; Toki Messe Niigata Convention CenterNiigata; Japan; 17 April 2019 through 20 April 2019, 167–172, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/ICEP.2019.8733521
Uniaxial pressure control of competing orders in the cuprates Kim, H. H.; Souliou, S. M.; Barber, M. E.; Lefrancois, E.; Minola, M.; Heid, R.; Bosak, A.; Mackenzie, A. P.; Keimer, B.; Hicks, C. W.; Le Tacon, M. 2019. 11th International Conference on Inelastic X-ray Scattering (IXS2019 2019), Stony Brook, NY, USA, June 23–28, 2019
Towards Distributed Mixed Integer optimization in Energy Systems Murray, A.; Hagenmeyer, V.; Faulwasser, T. 2019. 2nd International Conference on "Future Electric Power Systems and the Energy Transition (FEPSET 2019), Champery, Switzerland, February 3–8, 2019
Understanding Counterexamples for Relational Properties with DIbugger Herda, M.; Kirsten, M.; Brunner, E.; Plewnia, J.; Scheler, U.; Staudenmaier, C.; Wagner, B.; Zwick, P.; Beckert, B. 2019. Proceedings of the Sixth Workshop on Horn Clauses for Verification and Synthesis and Third Workshop on Program Equivalence and Relational Reasoning (EPTCS), Prague, Czech Republic, 6-7th April 2019. Ed.: E. De Angelis, 6–13, Open Publishing Association. doi:10.4204/EPTCS.296.4