Dynamically-consistent Generalized Hierarchical Control Dehio, N.; Steil, J. J. 2019. 2019 IEEE International Conference on Robotics and Automation (ICRA 2019), May 20-24, 2019, Montreal, Canada, Institute of Electrical and Electronics Engineers (IEEE)
Capacitively Coupled Silicon-Organic Hybrid Modulator for 200 Gbit/s PAM-4 Signaling Ummethala, S.; Kemal, J. N.; Lauermann, M.; Alam, A. S.; Zwickel, H.; Harter, T.; Kutuvantavida, Y.; Hahn, L.; Nandam, S. H.; Elder, D. L.; Dalton, L. R.; Freude, W.; Randel, S.; Koos, C. 2019. 2019 Conference on Lasers and Electro-Optics (CLEO) : proceedings : San Jose, California, USA, 5-10 May 2019, JTh5B.2, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1364/CLEO_AT.2019.JTh5B.2
Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers Ishikawa, D.; An, B. N.; Mail, M.; Wurst, H.; Leyrer, B.; Blank, T.; Weber, M.; Ueda, S.; Nakako, H.; Kawana, Y. 2019. 2019 International Conference on Electronics Packaging, ICEP 2019; Toki Messe Niigata Convention CenterNiigata; Japan; 17 April 2019 through 20 April 2019, 167–172, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/ICEP.2019.8733521
Uniaxial pressure control of competing orders in the cuprates Kim, H. H.; Souliou, S. M.; Barber, M. E.; Lefrancois, E.; Minola, M.; Heid, R.; Bosak, A.; Mackenzie, A. P.; Keimer, B.; Hicks, C. W.; Le Tacon, M. 2019. 11th International Conference on Inelastic X-ray Scattering (IXS2019 2019), Stony Brook, NY, USA, June 23–28, 2019