Compact electro-thermal models of semiconductor devices with multiple heat sources
Bohm, C.; Hauck, T.; Rudnyi, E. B.; Korvink, J. G.
2004. Thermal and mechanical simulation and experiments in microelectronics and microsystems : Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, ESIME 2004, March 10 - 12, Novotel Tour Noire, Brussels, Belgium. Ed.: L. J. Ernst, 101–104, Maastricht. doi:10.1109/ESIME.2004.1304028