PT Journal AU Worgull, M Schneider, M Röhrig, M Meier, T Heilig, M Kolew, A Feit, K Hölscher, H Leuthold, J TI Hot embossing and thermoforming of biodegradable three-dimensional wood structures SO RSC Advances PY 2013 BP 20060 EP 20064 VL 3 IS 43 DI 10.1039/c3ra42642d LA english ER