PT Journal
AU Worgull, M
   Schneider, M
   Röhrig, M
   Meier, T
   Heilig, M
   Kolew, A
   Feit, K
   Hölscher, H
   Leuthold, J
TI Hot embossing and thermoforming of biodegradable three-dimensional wood structures
SO RSC Advances
PY 2013
BP 20060
EP 20064
VL 3
IS 43
DI 10.1039/c3ra42642d
LA english
ER