PT Unknown
AU Koos, C
   Freude, W
   Randel, S
   Billah, MR
   Blaicher, M
   Dietrich, P
   Hoose, T
   Xu, Y
   Hofmann, A
TI Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
SE SPIE Photonics Europe 2018 Strasbourg, April 23 – 26
PY 2018
BP paper
EP 10686
LA english
PI Straßburg, Frankreich
ER