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Postprint
DOI: 10.5445/IR/1000058907
Veröffentlicht am 04.05.2018

Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects

Koos, Christian; Freude, Wolfgang; Leuthold, J.; Dalton, L. R.; Wolf, Stefan M.; Zwickel, H.; Hoose, Tobias; Billah, Muhammad Rodlin; Lauermann, Matthias; Weimann, Claudius; Hartmann, Wladislaw; Melikyan, Argishti; Lindenmann, Nicole; Koeber, Sebastian; Palmer, Robert; Korn, Dietmar; Alloatti, Luca; Giesecke, A.-L.; Wahlbrink, T.

Abstract:
Limitations of silicon photonics can be overcome by hybrid integration of silicon photonic or plasmonic circuits with organic materials or by photonic multi-chip systems. We give an overview on our recent progress regarding both silicon-organic hybrid (SOH) integration and multi-chip integration enabled by photonic wire bonding.


Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Institut für Photonik und Quantenelektronik (IPQ)
Publikationstyp Proceedingsbeitrag
Jahr 2016
Sprache Englisch
Identifikator ISBN: 978-150901874-1
URN: urn:nbn:de:swb:90-589071
KITopen-ID: 1000058907
HGF-Programm 43.23.03 (POF III, LK 01)
Erschienen in 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016, San Diego, United States, 9 May 2016 through 11 May 2016
Verlag IEEE, Piscataway (NJ)
Seiten 86-87
Projektinformation Hyphen (EU, H2020, 680916)
Schlagworte Silicon photonics, silicon-organic hybrid (SOH) integration, plasmonic-organic hybrid (SOH) integration, multi-chip integration, photonic wire bonding, optical interconnects
Nachgewiesen in Scopus
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