Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
Abstract:
Limitations of silicon photonics can be overcome by hybrid integration of silicon photonic or plasmonic circuits with organic materials or by photonic multi-chip systems. We give an overview on our recent progress regarding both silicon-organic hybrid (SOH) integration and multi-chip integration enabled by photonic wire bonding.
| Zugehörige Institution(en) am KIT | Institut für Mikrostrukturtechnik (IMT) Institut für Photonik und Quantenelektronik (IPQ) Universität Karlsruhe (TH) – Interfakultative Einrichtungen (Interfakultative Einrichtungen) Karlsruhe School of Optics & Photonics (KSOP) |
| Publikationstyp | Proceedingsbeitrag |
| Publikationsjahr | 2016 |
| Sprache | Englisch |
| Identifikator | ISBN: 978-150901874-1 urn:nbn:de:swb:90-589071 KITopen-ID: 1000058907 |
| HGF-Programm | 43.23.03 (POF III, LK 01) Teratronics |
| Erschienen in | 5th IEEE Photonics Society Optical Interconnects Conference, OI 2016, San Diego, United States, 9 May 2016 through 11 May 2016 |
| Verlag | Institute of Electrical and Electronics Engineers (IEEE) |
| Seiten | 86-87 |
| Projektinformation | HYPHEN (EU, H2020, 680916) |
| Schlagwörter | Silicon photonics, silicon-organic hybrid (SOH) integration, plasmonic-organic hybrid (SOH) integration, multi-chip integration, photonic wire bonding, optical interconnects |
| Nachgewiesen in | Scopus Dimensions |