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Electric Circuit- and Wiring Harness-Aware Behavioral Simulation of Model-Based E/E-Architectures at System Level

Bucher, Harald; Becker, Jürgen

Abstract:
To cope with the rising complexity of automotive electric/electronic architectures (EEA), model-based development at system level is well-established and typically realized in architecture description languages (ADLs) and high-level tools. In this paper, we extend a previously developed approach for automated cross-domain simulation synthesis of model-based EEA descriptions enabling system-level evaluation by a behavioral specification layer. The key contributions of this work are modeling extensions applied to a state-of-the-art EEA ADL to refine specified behavior during synthesis with electric circuits including wiring harness details modeled at the hardware layer. Preliminary experiments show that the novel combination of quantization- and SPICE-based synthesized circuit simulation, conducted in a discrete-event manner and applied to a buck converter, a typical device in an automotive EEA, increases simulation efficiency up to a factor of 2.0 compared to other state-of-the-art tools while preserving accuracy. Finally, another example EEA hardware network, modeling the dynamic current consumption of an Electric Power Steering act ... mehr

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Postprint §
DOI: 10.5445/IR/1000085479
Veröffentlicht am 13.12.2018
Originalveröffentlichung
DOI: 10.1109/SysEng.2018.8544434
Zugehörige Institution(en) am KIT Institut für Technik der Informationsverarbeitung (ITIV)
Publikationstyp Proceedingsbeitrag
Jahr 2018
Sprache Englisch
Identifikator ISBN: 978-1-5386-4446-1
urn:nbn:de:swb:90-854796
KITopen-ID: 1000085479
Erschienen in IEEE International Systems Engineering Symposium (ISSE), Rome, I, October 1-3, 2018
Verlag IEEE, Piscataway, NJ
Seiten 1-8
Vorab online veröffentlicht am 29.11.2018
Schlagworte MBSE, Automotive E/E-Architectures, Integrated circuit modeling, Computer architecture, Data models, Wiring, Tools, Hardware, Mathematical model, Automotive, E/E-Architectures, ADL, Wiring Harness, MBSE, QSS, Modeling and Simulation, SPICE, Ptolemy II, PREEvision
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