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Modeling the Interdependences between Voltage Fluctuation and BTI Aging

Salamin, Sami 1; Van Santen, Victor M. ORCID iD icon 1; Amrouch, Hussam 1; Parihar, N.; Mahapatra, S.; Henkel, Jörg 1
1 Karlsruher Institut für Technologie (KIT)

Abstract:

With technology scaling, the susceptibility of circuits to different reliability degradations is steadily increasing. Aging in transistors due to bias temperature instability (BTI) and voltage fluctuation in the power delivery network of circuits due to IR-drops are the most prominent. In this paper, we are reporting for the first time that there are interdependences between voltage fluctuation and BTI aging that are nonnegligible. Modeling and investigating the joint impact of voltage fluctuation and BTI aging on the delay of circuits, while remaining compatible with the existing standard design flow, is indispensable in order to answer the vital question, “what is an efficient (i.e., small, yet sufficient) timing guardband to sustain the reliability of circuit for the projected lifetime?” This is, concisely, the key goal of this paper. Achieving that would not be possible without employing a physics-based BTI model that precisely describes the underlying generation and recovery mechanisms of defects under arbitrary stress waveforms. For this purpose, our model is validated against varied semiconductor measurements covering a wide range of voltage, temperature, frequency, and duty cycle conditions. ... mehr


Postprint §
DOI: 10.5445/IR/1000096491
Originalveröffentlichung
DOI: 10.1109/TVLSI.2019.2899890
Scopus
Zitationen: 11
Dimensions
Zitationen: 11
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Technische Informatik (ITEC)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2019
Sprache Englisch
Identifikator ISSN: 1063-8210, 1557-9999
KITopen-ID: 1000096491
Erschienen in IEEE transactions on very large scale integration (VLSI) systems
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Band 27
Heft 7
Seiten 1652-1665
Vorab online veröffentlicht am 12.03.2019
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