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Lithographic Performance of Aryl Epoxy Thermoset Resins as Negative Tone Photoresist for Microlithography

Vlnieska, Vitor; Zakharova, Margarita; Mikhaylov, Andrey; Kunka, Danays

Abstract:
Photoresists (or photo-resins) are the main and most important raw material used for lithography techniques such as deep X-ray (DXRL), ultraviolet (UVL), deep-UV (DUVL), and extreme UV (EUVL). In previous work, we showed how complicated could be the synthesis of the resins used to produce photoresist. In this study, we follow up on the strategy of tuning deep and macro levels of properties to formulate photo-resins. They were developed from a primary basis, using epoxy resins, a solvent, and a photoinitiator in several concentrations. The formulations were evaluated initially by the UVL technique, using a squared pattern of 2.3 mm$^{2}$. The most suitable compositions were then studied in a pattern structure varying from 50 down to 1 µm width, applying UVL and DUVL. The patterned structures were compared with the chemical composition of the photo-resins. Considering the deep level of properties, polydispersion, and epoxidation degree were evaluated. Regarding the macro level of properties, the concentration of photoinitiator was studied. Promising results have been achieved with the control of the deep and macro levels methodology. By means of UV lithography, it was possible to note, for a large feature size above 2.0 mm$^{2}$, the formulations presented good quality structures with a broad range of epoxidation degrees and photoinitiator concentrations, respectively from 3 to 100% (mol·mol$_{polymer}$$^{-1}$) and from 10 to 40% (mol·mol$_{polymer}$$^{-1}$). ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000124927
Veröffentlicht am 26.01.2021
Originalveröffentlichung
DOI: 10.3390/polym12102359
Scopus
Zitationen: 1
Dimensions
Zitationen: 1
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Mikrostrukturtechnik (IMT)
Publikationstyp Zeitschriftenaufsatz
Publikationsjahr 2020
Sprache Englisch
Identifikator ISSN: 2073-4360
KITopen-ID: 1000124927
HGF-Programm 43.23.02 (POF III, LK 01) X-Ray Optics
Erschienen in Polymers
Verlag MDPI
Band 12
Heft 10
Seiten 2359
Vorab online veröffentlicht am 14.10.2020
Schlagwörter epoxy resins, photo-resins (photoresists), UV lithography, deep ultraviolet Lithography
Nachgewiesen in Web of Science
Dimensions
Scopus
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