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Split Boot—True Network-Based Booting on Heterogeneous MPSoCs

Fuchs, Marvin 1; Ardila-Perez, Luis E. E. ORCID iD icon 1; Mehner, Torben ORCID iD icon 1; Sander, Oliver 1
1 Institut für Prozessdatenverarbeitung und Elektronik (IPE), Karlsruher Institut für Technologie (KIT)

Abstract:

In the context of the high-luminosity (HL) upgrade of the large hadron collider (LHC), many custom ATCA electronic boards are being designed containing heterogeneous system-on-chip (SoC) devices, more specifically the Xilinx Zynq UltraScale+ (ZUS+) family. While the application varies greatly, these devices are regularly used for performing board management tasks, making them a fundamental element in the correct operation of the board. A large number of hundreds of SoC devices create significant challenges in their firmware deployment, maintenance, and accessibility. Even though U-Boot on ZUS+ devices supports network boot through the preboot execution environment (PXE), the standard ZUS+ boot process contains application-specific information at earlier boot steps, particularly within the first-stage bootloader (FSBL). This prevents the initialization of several devices from a universal image. Inspired by the PXE boot process on desktop PCs, this article describes split boot, a novel boot method tailored to the specific needs of the ZUS+. All application-specific configuration is moved to a network storage device and automatically fetched during the boot process. ... mehr


Postprint §
DOI: 10.5445/IR/1000161255
Veröffentlicht am 16.02.2024
Originalveröffentlichung
DOI: 10.1109/TNS.2023.3237968
Scopus
Zitationen: 1
Dimensions
Zitationen: 2
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Prozessdatenverarbeitung und Elektronik (IPE)
Publikationstyp Zeitschriftenaufsatz
Publikationsmonat/-jahr 06.2023
Sprache Englisch
Identifikator ISSN: 0018-9499, 1558-1578
KITopen-ID: 1000161255
HGF-Programm 54.12.02 (POF IV, LK 01) System Technologies
Erschienen in IEEE Transactions on Nuclear Science
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Band 70
Heft 6
Seiten 1157–1163
Nachgewiesen in Dimensions
Web of Science
Scopus
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