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RKKY to Kondo crossover in helical edge of a topological insulator

Ferrer, Pol Alonso-Cuevillas; Yevtushenko, Oleg M. 1; Weichselbaum, Andreas
1 Institut für Theorie der Kondensierten Materie (TKM), Karlsruher Institut für Technologie (KIT)

Abstract:

Two spatially separated magnetic impurities coupled to itinerant electrons give rise to a dynamically generated exchange (RKKY) inter-impurity interaction that competes with the individual Kondo screening of the impurities. It has been recently shown by Yevtushenko and Yudson [Phys. Rev. Lett. 120, 147201 (2018)] that the RKKY interaction and the RKKY vs Kondo competition become nontrivial on helical edges of two-dimensional topological insulators where there is lock-in relation between the electron spin and its direction of motion. Kondo screening always takes over and dominates at large inter-impurity distances and it can also dominate all the way to short distances if the Kondo coupling is sufficiently large and anisotropic. In the present paper, we study the Kondo-RKKY competition in detail on a qualitative and quantitative level. For this we employ the numerically exact numerical renormalization group (NRG) for a broad parameter scan of two Kondo coupled impurities vs magnetic anisotropy, impurity distance, and temperature, and comment on the role of finite bandwidth. We give a pedagogical introduction on the the setup of the two-impurity setting within the NRG in the helical context. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000161405
Veröffentlicht am 16.08.2023
Originalveröffentlichung
DOI: 10.1103/PhysRevResearch.5.033016
Scopus
Zitationen: 3
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Zitationen: 4
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Theorie der Kondensierten Materie (TKM)
Publikationstyp Zeitschriftenaufsatz
Publikationsmonat/-jahr 07.2023
Sprache Englisch
Identifikator ISSN: 2643-1564
KITopen-ID: 1000161405
Erschienen in Physical Review Research
Verlag American Physical Society (APS)
Band 5
Heft 3
Seiten Art.-Nr.: 033016
Bemerkung zur Veröffentlichung Gefördert durch den KIT-Publikationsfonds
Vorab online veröffentlicht am 10.07.2023
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