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The role of incoherent twin boundaries on the plasticity of Cu micropillars

Hosseinabadi, Reza; Brognara, Andrea; Kirchlechner, Christoph 1; Best, James P.; Dehm, Gerhard
1 Institut für Angewandte Materialien – Werkstoff- und Grenzflächenmechanik (IAM-MMI), Karlsruher Institut für Technologie (KIT)

Abstract:

The role of a ∑3{1 1 2} incoherent twin boundary (ITB) on the shear stress of Cu at the micron scale has been investigated through microcompression of bi-crystalline pillars containing ITB, as well as single-crystalline pillars, in two different compression directions. The Cu sample containing ITBs was synthesized using magnetron sputtering on a sapphire substrate. Firstly, pillars along [1 1 1] compression direction were milled on the film surface. As multiple slip systems were activated upon loading, the dislocation-ITB interaction in this direction was dominated by the dislocation–dislocation interactions. Another set of pillars was milled from the side of the film (in the thickness of the film) in a nominally [13] compression direction. Compression in this direction activated a single slip in each grain, which facilitated the investigation of the interaction between dislocations and ITBs. Post-mortem images showed that slip traces were not distinctly connected at the boundary unlike ideal slip transmission in pillars containing a coherent twin boundary. Moreover, bi-crystalline pillars in the single slip direction are stronger than single-crystalline pillars. ... mehr


Verlagsausgabe §
DOI: 10.5445/IR/1000162048
Veröffentlicht am 08.09.2023
Originalveröffentlichung
DOI: 10.1016/j.matdes.2023.112164
Scopus
Zitationen: 3
Web of Science
Zitationen: 2
Dimensions
Zitationen: 3
Cover der Publikation
Zugehörige Institution(en) am KIT Institut für Angewandte Materialien – Werkstoff- und Grenzflächenmechanik (IAM-MMI)
Publikationstyp Zeitschriftenaufsatz
Publikationsmonat/-jahr 08.2023
Sprache Englisch
Identifikator ISSN: 0264-1275
KITopen-ID: 1000162048
HGF-Programm 43.31.01 (POF IV, LK 01) Multifunctionality Molecular Design & Material Architecture
Erschienen in Materials & Design
Verlag Elsevier
Band 232
Seiten Art.-Nr. 112164
Vorab online veröffentlicht am 14.07.2023
Nachgewiesen in Dimensions
Web of Science
Scopus
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