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Improved Test Circuit for Characterization of the Dynamic On-Resistance of GaN-HEMTs over a Wide Operating Range

Swoboda, Philipp ORCID iD icon 1; Frank, Simon Robin ORCID iD icon 1; Liske, Andreas ORCID iD icon 1; Hiller, Marc 1
1 Elektrotechnisches Institut (ETI), Karlsruher Institut für Technologie (KIT)

Abstract (englisch):

GaN-HEMTs show excellent switching and conduction characteristics and are an excellent candidate to replace Si-based power semiconductors with voltage ratings of up to $650 \, \mathrm{V}$. However, trapping phenomena, such as the dynamic on-resistance $R_\mathrm{ds,on}$, have not yet been fully eliminated. As these can significantly influence the conduction losses and reliability of GaN-HEMTs, suitable characterization methods are required. This paper presents an improved test circuit to characterize the dynamic on-resistance $dR_\mathrm{ds,on}$ over a wide operating range. This includes positive and negative drain currents \gls{sym:id}, adjustable gate-voltages $V_\mathrm{gs}$ and temperatures $T_\mathrm{c}$. In order to stimulate trapping phenomena, the bias voltage on the DUT (Device Under Test) in the off-state $V_\mathrm{ds}$ is adjustable in magnitude and duration (soak time). In addition, the drain current $I_\mathrm{d}$ of the DUT only flows for the duration of the measuring interval, which leads to less self-heating. For an improved measurement of the drain-source voltage $V_\mathrm{ds}$ in the on-state, an improved clamp-circuit was developed. ... mehr


Postprint §
DOI: 10.5445/IR/1000176527
Veröffentlicht am 21.11.2024
Originalveröffentlichung
DOI: 10.1109/ECCEEurope62508.2024.10751914
Cover der Publikation
Zugehörige Institution(en) am KIT Elektrotechnisches Institut (ETI)
Publikationstyp Proceedingsbeitrag
Publikationsdatum 02.09.2024
Sprache Englisch
Identifikator ISBN: 979-8-3503-6445-3
KITopen-ID: 1000176527
Erschienen in 2024 Energy Conversion Congress & Expo Europe (ECCE Europe)
Veranstaltung IEEE Energy Conversion Congress and Exposition (ECCE Europe 2024), Darmstadt, Deutschland, 02.09.2024 – 06.09.2024
Verlag Institute of Electrical and Electronics Engineers (IEEE)
Seiten 1-8
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