On the Challenges of Transforming UVL to IVML Agarwal, P.; Feichtinger, K.; Schmid, K.; Eichelberger, H.; Rabiser, R. 2024. Proceedings of the 6th International Workshop on Languages for Modelling Variability (MODEVAR’24), arxiv
A Ku-Band Power Amplifier in 22nm FDSOI Haag, A.; Ulusoy, A. Ç. 2024. 2024 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), San Antonio, Tx, 21st-24th January 2024, 1 – 4, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SiRF59913.2024.10438628
Enhancing Efficiency in HAR Models: NAS Meets Pruning Zhou, Y.; King, T.; Huang, Y.; Zhao, H.; Riedel, T.; Röddiger, T.; Beigl, M. 2024. 22nd IEEE International Conference on Pervasive Computing and Communications (PerCom 2024), Institute of Electrical and Electronics Engineers (IEEE)
Unterrichtsstörungen im digitalen Setting Meinokat, P. 2024, March 12. 29th Kongress der Deutschen Gesellschaft für Erziehungswissenschaft: Krisen und Transformationen (DGfE 2024), Halle (Saale), Germany, March 10–13, 2024
Material losses characterization in superconducting resonators based on α and β Tantalum Dhundhwal, R.; Duan, H.; Brauch, L.; Arabi, S.; Li, Q.; Pal, S.; Palomo, J.; Fuchs, D.; Welle, A.; Scheffler, M.; Leghtas, Z.; Aghassi-Hagmann, J.; Kübler, C.; Wulfhekel, W.; Pop, I. M.; Reisinger, T. 2024, March. 87. Jahrestagung der DPG und DPG-Frühjahrstagung der Sektion Kondensierte Materie (SKM 2024), Berlin, Germany, March 17–22, 2024