Formal probabilistic analysis of distributed resource management schemes in on-chip systems Iqtedar, S.; Hasan, O.; Shafique, M.; Henkel, J. 2016. Proceedings of the 19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016; International Congress Centre Dresden (ICC)Dresden; Germany; 14 March 2016 through 18 March 2016, 930–935, Institute of Electrical and Electronics Engineers (IEEE)
Distributed fair scheduling for many-cores Pathania, A.; Venkataramani, V.; Shafique, M.; Mitra, T.; Henkel, J. 2016. Proceedings of the 19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016; International Congress Centre Dresden (ICC)Dresden; Germany; 14 March 2016 through 18 March 2016, 379–384, Institute of Electrical and Electronics Engineers (IEEE)
Aging-aware voltage scaling Van Santen, V. M.; Amrouch, H.; Parihar, N.; Mahapatra, S.; Henkel, J. 2016. Proceedings of the 19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016; International Congress Centre Dresden (ICC)Dresden; Germany; 14 March 2016 through 18 March 2016, 576–581, Institute of Electrical and Electronics Engineers (IEEE)
Search for XYZ states in υ (1S) inclusive decays Belle Collaboration; Shen, C. P.; Yuan, C. Z.; Ban, Y.; Aihara, H.; Asner, D. M.; Badhrees, I.; Bakich, A. M.; Barberio, E.; Behera, P.; Bhardwaj, V.; Bhuyan, B.; Biswal, J.; Bondar, A.; Bonvicini, G.; Bozek, A.; Bračko, M.; Browder, T. E.; Červenkov, D.; Chekelian, V.; et al. 2016. Physical review / D, 93 (11), 112013. doi:10.1103/PhysRevD.93.112013
Thermal-aware TSV repair for electromigration in 3D ICs Wang, S.; Tahoori, M. B.; Chakrabarty, K. 2016. Proceedings of the 19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016; International Congress Centre Dresden (ICC)Dresden; Germany; 14 March 2016 through 18 March 2016, 1291–1296, Institute of Electrical and Electronics Engineers (IEEE)