The EC-system of EU DEMO: concepts for a reactor heating system Granucci, G.; Aiello, G.; Avramidis, K. A.; Bruschi, A.; Gantenbein, G.; Garavaglia, S.; Grossetti, G.; Jelonnek, J.; Moro, A.; Poli, E.; Rispoli, N.; Strauss, D.; Thumm, M.; Tigelis, I.; Tsironis, C.; Franke, T.; Tran, M. Q. 2017. (A. G. Litvak, Ed.) The European physical journal / Web of Conferences, 149, Art. Nr. 03003. doi:10.1051/epjconf/201714903003
Extension of the multi-frequency ECRH system at ASDEX upgrade Wagner, D.; Stober, J.; Kircher, M.; Leuterer, F.; Monaco, F.; Münich, M.; Schubert, M.; Zohm, H.; Gantenbein, G.; Jelonnek, J.; Thumm, M.; Meier, A.; Scherer, T.; Strauss, D.; Kasparek, W.; Lechte, C.; Plaum, B.; Zach, A.; Litvak, A. G.; Denisov, G. G.; et al. 2017. (ASDEX Upgrade Team, Ed.) The European physical journal / Web of Conferences, 149, Art. Nr. 03004. doi:10.1051/epjconf/201714903004
Managing Provenance for Medical Datasets Prabhune, A.; Stotzka, R.; Gertz, M.; Zheng, L.; Hesser, J. 2017. 10th International Joint Conference on Biomedical Engineering Systems and Technologies (BIOSTEC 2017), Porto, P, February 21-23, 2017
eCodicology: The Computer and the Mediaeval Library Busch, H.; Chandna, S. 2017. Kodikologie und Paläographie im digitalen Zeitalter 4 / Codicology and Palaeography in the Digital Age 4. Ed.: H. Busch, Books on Demand
Orbital angular momentum of gyrotron modes Sawant, A.; Choe, M. S.; Thumm, M.; Choi, E. 2017. 42nd International Conference on Infrared Millimeter and Terahertz Waves (Cancun, MEX, August 27 - September 1, 2017 (IRMMW-THz)
GREAT : HeteroGeneous IntegRated Magnetic tEchnology Using Multifunctional Standardized sTack Tahoori, M.; Nair, S. M.; Bishnoi, R.; Senni, S.; Mohdad, J.; Mailly, F.; Torres, L.; Benoit, P.; Nouet, P.; Ma, R.; Kreißig, M.; Ellinger, F.; Jabeur, K.; Vanhauwaert, P.; Pendina, G. D.; Prenat, G. 2017. 2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Bochum, Germany, 3rd - 5th July 2017. Ed.: M. Hübner, 344–349, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ISVLSI.2017.67